Recently, the Administrative Committee of China (Shanghai) Pilot Free Trade Zone Lingang New Area officially released the Action Plan for Building a Future Industrial Cluster of 4th-Generation Semiconductors (2026–2028). This document marks China’s first local special industrial policy tailored exclusively to the 4th-generation semiconductor sector. The plan defines two major development tracks: ultra-wide bandgap semiconductors including gallium oxide, diamond and aluminum nitride, as well as ultra-narrow bandgap semiconductors such as indium antimonide and gallium antimonide.

Lingang is building a full-chain cultivation system covering basic research, technological breakthroughs, concept verification, engineering verification, scenario demonstration and large-scale application, while strengthening scientific research in materials, devices, processes and application links. BSL (Baoshili) Shanghai Branch is located in Lingang New Area, specializing in Ultra-Clean PFA Tube,Ultra-Clean HDPE Drum and other semiconductor-grade electronic chemical transfer and packaging consumables. Its product line serves as the connecting link between the supply of electronic chemicals and process application.

01. The "Invisible Essential Demand" in the Industrial Chain

For 4th-generation semiconductors to move from laboratories to production lines, numerous process steps rely on stable delivery of high-purity chemicals. Wet cleaning of gallium oxide wafers and CMP polishing of diamond substrates all adopt electronic chemicals such as sulfuric acid, hydrogen peroxide and hydrofluoric acid. Transfer pipelines and packaging containers come into direct contact with process media. Metal ion leaching, TOC release and particle shedding from pipeline materials directly affect wafer defect density. Hence, high-purity packaging and transfer consumables for electronic chemicals are often referred to as an "invisible essential demand".

02. From Product Commercialization to Standard Formulation

At present, the supply of semiconductor-grade PFA tubes and HDPE drums is highly concentrated among Japanese, European and American enterprises. Semiconductor-grade chemical packaging and transfer consumables impose extremely stringent requirements on raw material purity, extrusion processes and control of metal leaching.

Through continuous technological research, BSL has taken the lead in achieving breakthroughs in this sector and developed two innovative products: Ultra-Clean PFA Tube and Ultra-Clean HDPE Drum. The Ultra-Clean PFA Tube features ppt-level control of metal ion leaching, outstanding chemical corrosion resistance, smooth inner walls and consistent quality. For the Ultra-Clean HDPE Drum, key metal ions including sodium, potassium, iron, copper and nickel are also controlled at the ppt level, ensuring long-term stability of wet electronic chemicals during storage and transportation.

Building on this foundation, BSL is translating its product advantages into standard-setting capabilities to drive the upgrading of industry specifications. BSL acts as the lead drafting organization for the group standard Semiconductor-Grade Meltable Polytetrafluoroethylene (PFA) Tubes, and the primary drafting organization for the group standard Requirements for Packaging, Storage and Transportation of Wet Electronic Chemicals, which was officially implemented this April. Up to now, BSL’s ultra-clean product series have entered the supply chains of mainstream fabs and equipment suppliers, forming an initial product matrix for chemical transfer and packaging consumables.

03. Jointly Promoting Industrial Upgrading

BSL Shanghai Branch is situated within the same zone as the Oriental Core Harbour Integrated Circuit Industrial Cluster. Strict cleanliness control must be maintained throughout the whole logistics process for high-purity chemical transfer pipelines and packaging containers from factory delivery to fab incoming inspection. Physical distance directly impacts contamination risks and transportation costs during logistics. In addition, the qualification cycle for introducing semiconductor-grade consumables into fabs generally starts at six months. Suppliers need frequent communication and on-site commissioning with fab process teams, and shorter distances enable faster response and more direct engineering collaboration.

As the industrial framework for 4th-generation semiconductors in Lingang takes shape progressively, BSL will continue to focus on chemical transfer and packaging consumables and actively facilitate industrial upgrading.